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OCZ EL PC-3500 Gold GX and PC-4800 Platinum Review
Author: Dean Nottis
Date: July 18, 2005
Supplied By: OCZTechnology
Price: PC-4800 $254; PC-3500GX $180
Introduction
Today 3DXtreme is featuring two of the latest Memory offerings from our friends at OCZTechnology. These two new products target two different user types and two different price points. For the gamer looking to squeeze every last frame out of their game OCZ has created the OCZ EL PC-3500 Gold GX Dual Channel Memory kit. This kit features 2 x 512 MB of DDR433 (217Mhz FSB) that can run at 2-2-2-5 using only 2.8 volts. The PC-3500 GX features Winbond BH-5 ICs, Gold Heatspreaders and will be selling for approximately $180 for a 1GB kit.
The PC-4800 product is targeted towards the true enthusiast looking to run their Memory 1:1 with high HT overclocking primarily on the AMD64 platform. PC-4800 is rated to run DDR600 (300HT) with the memory timings of 2.5-4-4-10. These sticks feature Samsung TCC5 speed binned to deliver this top notch performance. Pricing on this 1GB kit is about $255 and it would be wise to make sure the motherboard and CPU can handle running memory at these speeds.
Let’s take a look at the performance delivered at each price point, and their overclocking abilities!
About OCZ
Entering the memory market in August 2000, OCZ Technology was built around the determination to manufacture the best high speed DDR and RDRAM. OCZ was founded by enthusiasts, for enthusiasts, and our commitment to the end-user has not digressed. OCZ Technology has been an innovator in many areas. We were the first manufacturer to make Dual Channel optimized memory available to the public, which originally took advantage of nVidia's Twinbank or Dual DDR architecture, found in their nForce chipset. We have now taken that technology and tailored it for the Canterwood, and Granite Bay chipset's. OCZ developed and was the first to implement ULN technology, which has been a critical element in our manufacturing process for some time. We at OCZ diligently work to improve communication with CPU and motherboard chipset manufacturers prior to the release of their products. Only in this manner can we fine-tune our memory's SPD settings, ensuring a synergistic relationship between the memory module, memory controller, and microprocessor. In today’s rapidly evolving semiconductor industry, such communication is not simply research, but a necessary component of our manufacturing process.

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